Clustered heat dissipation device and chassis with same
AssigneeAuras Technology Co., Ltd.
InventorsChien-An Chen, Mu-Shu Fan, Chien-Yu Chen
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AssigneeAuras Technology Co., Ltd.
InventorsChien-An Chen, Mu-Shu Fan, Chien-Yu Chen
Estimating the term…
A clustered heat dissipation device and a chassis are provided. The clustered heat dissipation device includes a heat-absorbing manifold, plural heat-absorbing heads and plural connection pipes. The heat-absorbing manifold includes an inlet chamber and an outlet chamber. The inlet chamber includes at least one first liquid inlet and plural first liquid outlets. The outlet chamber includes plural second liquid inlets and at least one second liquid outlet. The heat-absorbing manifold is in thermal contact with a first heat source. The plural connection pipes are connected with the heat-absorbing heads and the corresponding first liquid outlets and connected with the heat-absorbing heads and the corresponding second liquid inlets.
A clustered heat dissipation device, comprising:
A chassis, comprising:
Dependencies are inferred from the claim text.