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US 10,477,703 B2Granted
Wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorYuji Kunimoto
Life of this patent
Estimating the term…
Abstract
A wiring board includes an insulator layer, a wiring layer including a wiring pattern and formed on one surface of the insulator layer, an inorganic layer covering a region of the one surface of the insulator layer not formed with the wiring layer, and covering an upper surface and side surfaces of the wiring pattern along a concavo-convex of the wiring pattern, and a shield part covering the wiring pattern via the inorganic layer.
Claims12
A wiring board comprising:
- a first insulator layer;
- a first wiring layer, including a first wiring pattern, formed on one surface of the first insulator layer;
- a first inorganic layer covering a region of the one surface of the first insulator layer not formed with the first wiring layer, and further covering an upper surface and side surfaces of the first wiring pattern along a concavo-convex of the first wiring pattern;
- and
- a first shield part, made of a conductive material, and covering the first wiring pattern via the first inorganic layer, wherein
- the first wiring layer includes a first shield pad,
- the first inorganic layer covers an upper surface and side surfaces of the first shield pad along a concavo-convex of the first shield pad,
- the first inorganic layer includes a first opening exposing the upper surface of the first shield pad, and
- the first shield part covers the first wiring pattern and the first shield pad via the first inorganic layer, and is electrically connected to the first shield pad exposed within the first opening.
6 more elements
A wiring board comprising:
- a first insulator layer;
- a first wiring layer, including a first wiring pattern, formed on one surface of the first insulator layer;
- a first inorganic layer covering a region of the one surface of the first insulator layer not formed with the first wiring layer, and further covering an upper surface and side surfaces of the first wiring pattern along a concavo-convex of the first wiring pattern;
- and
- a first shield part, made of a conductive material, and covering the first wiring pattern via the first inorganic layer, wherein
- the first inorganic layer has a concavo-convex shape along a concavo-convex formed by adjacent first wiring patterns,
- the first shield part extends on the adjacent first wiring patterns by filling a concavo-convex formed by the adjacent first wiring patterns and the first inorganic layer,
- the first wiring layer includes a first shield pad,
- the first inorganic layer covers an upper surface and side surfaces of the first shield pad along a concavo-convex of the first shield pad,
- the first inorganic layer includes a first opening exposing the upper surface of the first shield pad, and
- the first shield part covers the first wiring pattern and the first shield pad via the first inorganic layer, and is electrically connected to the first shield pad exposed within the first opening.
8 more elements
Dependencies are inferred from the claim text.