Circuit board and method for manufacturing the same
AssigneeUnimicron Technology Corp.
InventorsPo-Hsuan Liao, Wen-Fang Liu
Life of this patent
Estimating the term…
Abstract
A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has at least one through hole. The through hole has an inner wall. The second dielectric layer is disposed on the adhesive layer and has a second through hole communicated with the first through hole. The conductive line is located in the second through hole of the second dielectric layer and is in contact with the inner wall of the adhesive layer.
Claims7
A circuit board, comprising:
- a substrate comprising a metal-containing board, a ceramic-containing board, or an organic-containing board;
- a first dielectric layer disposed on the substrate;
- a conductive layer between the substrate and the first dielectric layer;
- an adhesive layer bonded to the first dielectric layer and having a first through hole;
- a second dielectric layer disposed on the adhesive layer and having a second through hole communicated with the first through hole;
- a conductive line located in the first through hole of the adhesive layer and the second through hole of the second dielectric layer and in contact with a top surface of the first dielectric layer;
- and
- a conductive contact passing through the first and second dielectric layers and in contact with a top surface of the conductive layer and the adhesive layer.
Dependencies are inferred from the claim text.