Method for manufacturing electronic component attached wiring board

A method for manufacturing an electronic component attached wiring board, comprising:

• preparing a first support plate;
• forming a plurality of aggregate wiring boards on a surface of the first support plate such that the aggregate wiring boards each including a plurality of wiring boards side by side are formed in a connected state on the surface of the first support plate;
• separating the first support plate from the plurality of aggregate wiring boards in the connected state;
• dividing the plurality of aggregate wiring boards in the connected state into a plurality of individual aggregate wiring boards each including the plurality of wiring boards;
• bonding a second support plate to a surface of each of the individual aggregate wiring boards such that each of the individual aggregate wiring boards is bonded to a surface of the second support plate;
• mounting a plurality of electronic components on the wiring boards in each of the individual aggregate wiring boards on the second support plate respectively such that each of the wiring boards in each of the individual aggregate wiring boards has a respective one of the electronic components mounted thereon;
• dividing the plurality of wiring boards in each of the individual aggregate wiring boards into a plurality of individual wiring boards;
• and
• separating the second support plate from the plurality of individual wiring boards,
• wherein the surface of the first support plate has a first size which is larger than a second size of the surface of the second support plate.