Solder columns and methods for making same
AssigneeThe Topline Corporation
InventorMartin B. Hart
Life of this patent
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Abstract
An improved solder column, having a solder core comprising a solder core material, an exoskeleton sleeve structure surrounding at least a majority of an outside surface of the solder core and comprising a plurality of wires woven together to form a mesh, and a plurality of spaces formed in the exoskeleton between the plurality of wires. The exoskeleton sleeve can be configured such that the exoskeleton sleeve will support the solder core so as to prevent a collapse of the solder core at temperatures exceeding a liquidus temperature of the solder core. Optionally, each of the plurality of spaces can have a width and a height that is at least as large as a width of the wire adjacent to the space, and the spaces can be configured to provide additional flexibility to the solder column.
Claims26
A solder column, comprising:
- a solder core comprising a solder core material;
- an exoskeleton sleeve structure surrounding at least a majority of an outside surface of the solder core and comprising a plurality of wires woven together to form a mesh;
- and
- a plurality of spaces formed in the exoskeleton between the plurality of wires;
- wherein:
- the exoskeleton sleeve is configured such that the exoskeleton sleeve will support the solder core so as to prevent a collapse of the solder core at temperatures exceeding a liquidus temperature of the solder core;
- each of the plurality of spaces has a width and a height that is at least as large as a width of the wire adjacent to the space;
- and
- the spaces are configured to provide additional flexibility to the solder column to improve the ability of the solder column to absorb stresses caused by mismatches in the coefficient of thermal expansion between the substrates interconnected by the solder column.
A solder column, comprising:
- a solder core comprising a solder core material;
- an exoskeleton sleeve structure surrounding at least a portion of the solder core and comprising a plurality of wires woven together to form a mesh;
- and
- a plurality of spaces formed in the exoskeleton between the plurality of wires;
- wherein:
- the plurality of wires comprises a plurality of wire pairs each comprising a first wire and a second wire, the second wire being adjacent to the first wire along an entire length of the first wire;
- the exoskeleton sleeve is configured to support the solder core, particularly at elevated temperatures exceeding a liquidus temperature of the solder core, and to improve the heat conduction of the solder column;
- and
- the spaces are configured to provide additional flexibility to the solder column to improve the ability of the solder column to absorb stresses caused by mismatches in the coefficient of thermal expansion between the substrates interconnected by the solder column.
Dependencies are inferred from the claim text.