Mounting apparatus

A mounting apparatus for mounting an electronic component on a substrate, the apparatus comprising:

• a first movable base movable in a specified first direction;
• a second movable base attached to the first movable base and movable in a second direction orthogonal to the first direction;
• a mounting head attached to the second movable base including a mounting tool for sucking and holding the electronic component;
• a pressurizing mechanism attached to the first movable base via
• an elastic body and arranged to apply a force in the second direction to the mounting head;
• and
• a pressure receiving member provided independently of the first movable base and the second movable base and installed in proximity to the pressurizing mechanism to receive a reaction force in the second direction from the pressurizing mechanism, the pressurizing mechanism slidable on the pressure receiving member,
• wherein the pressurizing mechanism does not move in a vertical direction with the mounting head, and
• wherein the elastic body holds the pressurizing mechanism against gravity without holding the mounting head and allows upward directional movement of the pressing mechanism in the vertical direction by deflecting in the vertical direction with receiving the reaction force.