Wiring board manufacturing method and wiring board

A wiring board comprising:

• a base material having a pattern of a high surface free energy region and a low surface free energy region;
• and
• a conductor pattern formed on the high surface free energy region,
• wherein the high surface free energy region has a surface free energy of more than 62 mJ/m2.

A method for manufacturing a pattern formation body comprising:

• a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred;
• and
• a pattern forming step of applying a coating composition onto a pattern transfer surface of the base material to form a pattern,
• wherein the base material has a pattern of a high surface free energy region and a low surface free energy region, and
• wherein the high surface free energy region has a surface free energy of more than 62 mJ/m2.

A resin composition comprising:

• a first compound inducing a low surface free energy;
• and
• a second compound inducing a surface free energy which is higher than that of the first compound,
• wherein the second compound contains a monofunctional (meth)acrylate, and
• wherein content of the monofunctional (meth)acrylate is 40 to 70 pts. mass with respect to 100 pts. mass of the second compound.