Method for manufacturing a printed circuit board element and printed circuit board element

Abstract

The method for manufacturing a printed circuit board element (10) having an inlay (16) and a current sensor (30) for determining a current flowing in the inlay (16), wherein, for the improvement of the positional accuracy of the inlay (16) relative to the current sensor (30), the method comprises the following steps: providing a layer (12) of printed circuit board material having a recess (14), providing an inlay (16) having an inlay outline, inserting the inlay (16) in the recess (14); embedding the inlay (16) in the recess (14); completing and laminating the layered printed circuit board structure; applying at least two alignment markings (M1, M2) on an uppermost printed circuit board layer (AL); forming a defined cross-section tapering (S) on the inlay outline, the tapering being aligned with the at least two alignment markings (M1, M2); applying an assembly marking for a current sensor (30) on an uppermost printed circuit board layer (AL), the assembly marking being aligned with the at least two alignment markings (M1, M2).

Dependencies are inferred from the claim text.