Printed board, light source device, semiconductor device, and methods of manufacturing same

A method of manufacturing a printed board, comprising:

• perforating a metal foil with a laser beam or punching to provide a through-hole extending in a thickness direction along a thickness of the printed board;
• providing an insulating layer;
• providing the metal foil having the through-hole on the insulating layer in the thickness direction;
• providing an adhesive between the insulating layer and the metal foil having the through-hole;
• pressing the metal foil toward the insulating layer to bond the metal foil to the insulating layer via the adhesive;
• providing a mask on the metal foil in the thickness direction to cover at least a part of the through-hole without covering an exposed part of the metal foil;
• and
• etching the exposed part of the metal foil to provide a wiring pattern on the insulating layer.

A method of manufacturing a printed board, comprising:

• perforating a metal foil with a laser beam or punching to provide a through-hole extending in a thickness direction along a thickness of the printed board;
• providing an uncured insulating layer;
• providing the metal foil having the through-hole on the uncured insulating layer in the thickness direction;
• pressing the metal foil toward the insulating layer to bond the metal foil to the insulating layer;
• providing a mask on the metal foil in the thickness direction to cover at least a part of the through-hole without covering an exposed part of the metal foil;
• and
• etching the exposed part of the metal foil to provide a wiring pattern.