Manufacturing method for EMI shielding structure

A manufacturing method of an electromagnetic interference (EMI) shielding structure, the method comprising:

• forming a shielding dam on a printed circuit board by continuously discharging an electroconductive material through a nozzle, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board;
• forming an insulating member on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions;
• forming a shielding member by covering an upper surface of the insulating member with the electroconductive material;
• and
• prior to the forming the shielding dam, disposing at least one dummy member on a corner of a moving path of the nozzle,
• wherein, in the forming the shielding dam, the nozzle moves, while discharging the electroconductive material, toward one surface of the dummy member wherein, in the forming the shielding dam, when the one surface of the dummy member is a sloped surface, the nozzle moves upwardly along the slope surface of the dummy member, while discharging the electroconductive material toward the sloped surface of the dummy member.