Apparatus, system, and method including a bridge device for interfacing a package device with a substrate

A system comprising:

• a printed circuit board (PCB) having a first side and a second side, the second side being opposite to, and spaced apart from, the first side;
• a hardware interface on the first side of the PCB, the hardware interface including a set of one or more first contacts;
• a set of one or more second contacts positioned on the second side of the PCB, wherein at least one second contact in the set of second contacts is coupled by a conductive path in the PCB to a corresponding first contact in the set of first contacts;
• and
• a packaged device coupled to the hardware interface so that the packaged device is coupled to at least the corresponding first contact;
• a bridge device positioned on the second side of the PCB, the bridge device including one or more pairs of bridge contacts that are coupled to each other by a conductive path in the bridge device wherein, for each pair of bridge contacts:
• one bridge contact is coupled to the at least one second contact that is electrically coupled to a corresponding first contact, and
• the other bridge contact is coupled to a third contact positioned on the second side of the PCB, wherein the bridge device creates a conductive path between the third contact and the packaged device.

A method comprising:

• coupling a packaged device to a hardware interface on the first side of a substrate, the substrate having a first side and a second side, the second side being opposite to, and spaced apart from, the first side, and the hardware interface including a set of one or more first contacts;
• coupling a bridge device to a set of one or more second contacts positioned on the second side of the substrate, wherein at least one second contact in the set of second contacts is coupled by a conductive path in the substrate to a corresponding first contact in the set of first contacts;
• and
• coupling the bridge device to one or more third contacts positioned on the second side of the substrate, wherein the bridge device includes one or more pairs of bridge contacts that are coupled to each other by a conductive path in the bridge device and wherein, for each pair of bridge contacts:
• one bridge contact is coupled to the at least one second contact that is electrically coupled to a corresponding first contact, and
• the other bridge contact is coupled to one of the one or more third contacts, wherein the bridge device creates a conductive path between each third contact and the packaged device.