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US 10,477,683 B2Granted
Printed circuit board including sub-circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYong-Ho Baek, Jung-Hyun Cho, Seung-Yeop Kook
Life of this patent
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Abstract
A printed circuit board includes: a core member including a through-hole; a sub-circuit board disposed in the through-hole; a first insulating layer disposed on opposing surfaces of the core member and opposing surfaces of the sub-circuit board; and an insulating material disposed between an inner wall of the through-hole and the sub-circuit board.
Claims21
A printed circuit board, comprising:
- a core member comprising a through-hole;
- a sub-circuit board disposed in the through-hole, the sub-circuit board comprising
- a high density circuit,
- stacked vias disposed in laminated layers, and
- an electronic device configured to transfer power between the sub-circuit board and a die connected to the printed circuit board;
- an outer layer circuit disposed on an outer layer of the sub-circuit board and having a density lower than a density of the high density circuit;
- a first insulating layer disposed on opposing surfaces of the core member and opposing surfaces of the sub-circuit board;
- and
- an insulating material disposed between an inner wall of the through-hole and the sub-circuit board,
- wherein the electronic device electrically connects a portion of the high density circuit to a portion of the outer layer circuit.
7 more elements
A printed circuit board, comprising:
- a first circuit board comprising a first circuit;
- a second circuit board disposed in a core member and embedded in the first circuit board between;
- and
- an outer layer circuit disposed on an outer layer of the second circuit board,
- wherein the second circuit board comprises a second circuit connected to the first circuit, and the second circuit board further comprises stacked vias disposed in laminated layers, and an electronic device configured to transfer power between the second circuit and a die connected to the printed circuit board, and
- wherein the second circuit comprises a circuit patter density that is higher than a circuit patter density of the first circuit and the outer layer circuit, and
- wherein the electronic device electrically connects a portion of the second circuit to a portion of the outer layer circuit.
4 more elements
Dependencies are inferred from the claim text.