Printed wiring board and method for manufacturing the same

A printed wiring board, comprising:

• a build-up layer comprising an insulating layer and a first conductor layer embedded in the insulating layer and including a component mounting pad;
• a covering layer formed on the build-up layer such that the covering layer is covering the insulating layer of the build-up layer and has an opening exposing the component mounting pad;
• a reinforcement layer formed on the covering layer and having a cavity penetrating through the reinforcement layer such that the cavity is exposing the component mounting pad in the build-up layer and the covering layer on the build-up layer;
• a conductor layer formed on the reinforcement layer such that the conductor layer is on an opposite side with respect to the covering layer on the build-up layer;
• and
• a via conductor formed in the reinforcement layer such that the via conductor electrically connects the first conductor layer in the build-up layer and the conductor layer on the reinforcement layer,
• wherein the first conductor layer is embedded in the insulating layer forming a surface of the build-up layer such that the first conductor layer has a surface exposed on the surface of the build-up layer.