US 10,477,680 B2 · Ink composition for light sintering, wiring board using same and manufacturing method therefor

Abstract

The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.

Claims12

Dependent claims

An ink composition for light sintering, comprising:

copper oxide nanoparticles having copper oxide films on surfaces of copper nanoparticles;
a solvent;
silver oxide;
and
a binder,
wherein the silver oxide and the copper oxide nanoparticles, except for the solvent, are comprised in an amount of 70% to 94% by weight, and
wherein the binder is a mixed resin including epoxy acrylate, polyvinyl acetal, and phenolic resin.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

16/118,096Filed 30 Aug 2018 · continuation

Priority

KR 10-2014-00385791 Apr 2014

Published

US 2018/0376592 A127 Dec 2018

Granted

12 Nov 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification20 codes

B22F 9/24
With reduction of metal compounds: starting from liquid metal compounds, e.g. solutions
B22F 1/0545
Nanosized particles: dispersions or suspensions of nanosized particles
B22F 1/107
Metallic powder containing lubricating or binding agents; Metallic powder containing organic material: containing organic material comprising…
B22F 1/16
Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties: metallic particles coated with a non-metal

Family

PCT/KR2015/003226Parent of this continuation · filed 1 Apr 2015

US 2018/0376592 A1Pre-grant publication · published 27 Dec 2018

Application15/301,341Parent of this continuation

US 10,091,875 B2Parent of this continuation

US 2017/0118836 A1Published application

US 10,477,680 B2This patent

From the US filing history. Foreign family members aren’t listed.

Ink composition for light sintering, wiring board using same and manufacturing method therefor

Life of this patent

Ink composition for light sintering, wiring board using same and manufacturing method therefor

Life of this patent

Abstract

Claims12