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US 10,477,679 B2Granted
Method for producing wiring board
AssigneeToppan Forms Co., Ltd.
InventorsKumi Hirose, Takuya Sekiguchi, Nariaki Nawa
Life of this patent
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Abstract
A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
Claims14
A method for producing a wiring board, comprising:
- producing a silver ink composition by mixing a silver carboxylate and a nitrogen-containing compound with a reducing agent, and then adding an alcohol thereto, and forming thin silver wires on a substrate by a printing method using the silver ink composition to form a wiring board,
- wherein a width of the thin silver wire in a cross-section in a direction perpendicular to a wire length direction thereof is 15 μm or less, and a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate,
- an aspect ratio of the thin silver wire in the cross-section in the direction perpendicular to the wire length direction thereof is 0.1 or less, and
- the reducing agent is mixed with the silver carboxylate and the nitrogen-containing compound by being dropped thereon.
1 more element
Dependencies are inferred from the claim text.