Substrate structure and manufacturing method thereof

A manufacturing method of a substrate structure, comprising:

• providing a core layer;
• forming a patterned copper layer on the core layer, wherein the patterned copper layer has at least one patterned opening region;
• forming a patterned nickel layer and a patterned conductive layer on the patterned copper layer;
• pressing an insulating material layer on the patterned conductive layer such that the insulating material layer covers the patterned copper layer and the patterned conductive layer and is filled in the patterned opening region;
• forming a build-up circuit layer on a second surface of the insulating material layer;
• and
• sequentially removing the core layer, the patterned copper layer, and the patterned nickel layer to form at least one damming protrusion,
• wherein the patterned conductive layer is embedded in the insulating material layer and exposed on a first surface of the insulating material layer and is electrically connected to the build-up circuit layer, and the damming protrusion is disposed on the first surface opposite the second surface of the insulating material layer and is integrally formed with the insulating material layer.