Uniformization of parasitic capacitance around wiring of a circuit substrate
AssigneeToshiba Memory Corporation
InventorSatoru Fukuchi
Life of this patent
Estimating the term…
Abstract
A circuit substrate includes an insulating body, a wiring enclosed by the insulating body, a conductive layer formed within the insulating body on a same plane as the wiring, and electrically insulated from the wiring by the insulating body, and one or more conductive vias extending through an edge portion of the conductive layer in a thickness direction intersecting the plane. A first width of the insulating body between the wiring and the conductive layer at a first position in the plane direction that does not correspond to any of said one or more conductive vias is smaller than a second width of the insulating body between the wiring and the conductive layer at a second position in the plane direction that corresponds to one of said one or more conductive vias.
Claims13
A circuit substrate comprising:
- an insulating body;
- a wiring enclosed by the insulating body and extending in a first direction:
- a first conductive layer formed within the insulating body in a same plane as the wiring, and electrically insulated from the wiring by the insulating body;
- and
- one or more conductive vias extending through an edge portion of the first conductive layer in a thickness direction intersecting the plane, wherein
- a first width of the insulating body in a second direction that crosses the first direction between the wiring and the first conductive layer at a first position in the plane that does not correspond to any of said one or more conductive vias is smaller than a second width of the insulating body in the second direction between the wiring and the first conductive layer at a second position in the plane direction that corresponds to one of said one or more conductive vias, and a width of the insulating body in the second direction continuously increases between the first and second positions;
- wherein each of the conductive vias is in contact with the insulating body in the plane.
A storage device comprising:
- a circuit substrate;
- a nonvolatile semiconductor memory module on the circuit substrate;
- a memory controller on the circuit substrate;
- and an interface formed on an edge of the circuit substrate, wherein the circuit substrate includes:
- an insulating body;
- a wiring enclosed by the insulating body and extending in a first direction:
- a conductive layer formed within the insulating body in a same plane as the wiring, and electrically insulated from the wiring by the insulating body;
- and
- one or more conductive vias extending through an edge portion of the conductive layer in a thickness direction intersecting the plane, wherein
- a first width of the insulating body in a second direction that crosses the first direction between the wiring and the conductive layer at a first position in the plane that does not correspond to any of said one or more conductive vias is smaller than a second width of the insulating body in the second direction between the wiring and the conductive layer at a second position in the plane direction that corresponds to one of said one or more conductive vias, and a width of the insulating body in the second direction continuously increases between the first and second positions;
- wherein each of the conductive vias is in contact with the insulating body in the plane.
Dependencies are inferred from the claim text.