Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages

A wireless communication module package comprising:

• a substrate;
• first and second electrical devices disposed on a surface of the substrate;
• an electrical ground structure that at least partially surrounds the first and second electrical devices;
• and
• a compartment electromagnetic interference (EMI) shield having first and second bond wires substantially in parallel to the surface of the substrate, wherein the first bond wire comprises a first lateral top portion having a first length that extends over the first electrical device and the second bond wire comprises a second lateral top portion having a second length that extends over the second electrical device and, and wherein the first and second bond wires comprises first and second vertical portions that extend from opposite ends of the respective lateral top portion and connect to the electrical ground structure, and
• wherein a frequency or frequency range of interest is attenuated at least in part by the compartment EMI shield.

A system module package comprising:

• a substrate;
• an electrical device disposed on a first region of the substrate;
• an electrical ground structure having two or more strips adjacent to two or more different sides of the first region,
• a first electrically-conductive wire having a first length, a first end and a second end, wherein the first end and the second end of the first electrically-conductive wire are respectively connected to two different strips of the two or more strips of the electrical ground structure;
• and
• a second electrically-conductive wire arranged substantially in parallel to the first electrically-conductive wire such that the first and second electrically-conductive wires are configured to at least attenuate in part a frequency or frequency range of interest,
• wherein the first electrically-conductive wire extends in a direction that forms an acute angle relative to one of the two or more strips of the electrical ground structure.

A system module package comprising:

• a surface;
• a device disposed on the surface;
• an electrical ground structure having two or more strips adjacent to two or more different sides of the device;
• and
• a first bond wire having a middle portion, a first end portion and a second end portion, wherein:
• the first end portion and the second end portion of the first bond wire are respectively connected to two different strips of the two or more strips of the electrical ground structure,
• the middle portion of the first bond wire extend over the device so as to shield the device from electromagnetic interference (EMI);
• and
• the middle portion of the first bond wire is spaced apart from a top surface of the device.