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US 10,477,669 B2Granted
Circuit substrate
AssigneeShimadzu Corporation
InventorKazuyuki Hashizume
Life of this patent
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Abstract
On a circuit board, a metal thin film is formed on a surface 101 of a board body. A linear slit is formed in a metal thin film, so that the metal thin film is separated into a first region and a second region with the slit interposed therebetween. The circuit board 1 includes a heat generation source (for example, an IC) arranged in the first region and an element arranged in the second region. A current flows through the element in a direction parallel to the slit.
Claims7
A circuit board comprising:
- a board body;
- a metal film formed on a surface or an inner layer of the board body;
- a linear slit formed in the metal film so that the metal film is separated into a first region and a second region with the slit interposed therebetween;
- a heat generation source arranged in the first region;
- and
- an element arranged in the second region and through which a current flows in a direction parallel to the slit,
- wherein heat from the heat generation source is transferred from the first region to the second region in an isothermal line parallel to the slit.
4 more elements
Dependencies are inferred from the claim text.