Complex electronic component and method for manufacturing the same

A complex electronic component comprising:

• an element part and an electrostatic discharge (ESD) protection part disposed on the element part,
• wherein the ESD protection part includes:
• first and second discharging electrodes having a gap disposed therebetween;
• a blocking layer arranged in a portion of the gap between the first and second discharging electrodes;
• and
• a discharging layer which is disposed to cover an upper portion of the blocking layer and is in contact with respective top surfaces of the first and second discharging electrodes in a stacking direction of the complex electronic component,
• wherein the blocking layer includes a reduced-thickness portion extending onto the respective top surfaces of the first and second discharging electrodes, and
• wherein the reduced-thickness portion is disposed on a different level from the first and second discharging electrodes in the stacking direction, and is in direct contact with a portion of the discharging layer.