Microphone package
AssigneeKabushiki Kaisha Toshiba
InventorsYoshihiro Higashi, Yoshihiko Fuji, Michiko Hara, Akiko Yuzawa, Shiori Kaji, Tomohiko Nagata, Akio Hori, Hideaki Fukuzawa
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AssigneeKabushiki Kaisha Toshiba
InventorsYoshihiro Higashi, Yoshihiko Fuji, Michiko Hara, Akiko Yuzawa, Shiori Kaji, Tomohiko Nagata, Akio Hori, Hideaki Fukuzawa
Estimating the term…
According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.
A sensor comprising:
A sensor comprising:
A sensor comprising:
Dependencies are inferred from the claim text.