Optical communication circuits
AssigneeXilinx, Inc.
InventorsAustin H. Lesea, Stephen M. Trimberger
Life of this patent
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Abstract
Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations, an apparatus includes a package substrate and f first interposer mounted on the package substrate. The apparatus also includes a logic circuit and an optical interface circuit connected to the logic circuit via the first interposer. One of the optical interface circuit or the logic circuit is mounted on the first interposer. The optical interface circuit includes a driver circuit configured to receive electronic data signals from the logic circuit. The optical interface circuit also includes an optical transmitter circuit coupled to the driver circuit and configured to output optical data signals encoding the electronic data signals.
Claims12
An apparatus comprising,
- a package substrate having one or more wiring layers;
- a first interposer mounted on the package substrate and having one or more wiring layers;
- a second interposer mounted on the package substrate;
- a logic circuit;
- an optical interface circuit connected to the logic circuit via the first interposer;
- and
- wherein:
- one of the optical interface circuit or the logic circuit is mounted on the first interposer, and the other one of the optical interface circuit or the logic circuit is mounted on the second interposer;
- the optical interface circuit is connected to the logic circuit via the first interposer and the second interposer;
- and
- the optical interface circuit includes:
- a driver circuit configured to receive electronic data signals from the logic circuit and carried over the one or more wiring layers of the package substrate and the one or more wiring layers of the interposer;
- and
- an optical transmitter circuit coupled to the driver circuit and configured to output optical data signals encoding the electronic data signals.
A method, comprising
- mounting a logic circuit on a first interposer having one or more wiring layers;
- forming an optical interface circuit on a second interposer having one or more wiring layers by mounting an optical transmitter circuit on the second interposer, mounting a driver circuit on the second interposer, and connecting the driver circuit via the one or more wiring layers on the second interposer;
- mounting the first interposer on a substrate having one or more wiring layers;
- mounting the second interposer on the substrate;
- and
- connecting the logic circuit and the optical interface circuit via the one or more wiring layers of the first interposer, the one or more wiring layers of the substrate, and the one or more wiring layers of the second interposer.
Dependencies are inferred from the claim text.