Communication between integrated circuit packages using a millimeter-wave wireless radio fabric

A method comprising:

• receiving a request to connect from a first package at a switch, wherein the first package has a first die, a plurality of first antennas, and a first radio transceiver, wherein the first radio transceiver is positioned near an outer edge of the first package and adjacent to the first die, and wherein the first die is conductively coupled to the plurality of first antennas and the first radio transceiver;
• sending a request to connect from the switch to a second package, wherein the second package has a second die, a plurality of second antennas, and a second radio transceiver, wherein the first package, the second package, and the switch are carried by a system board, wherein the second radio transceiver is positioned near an outer edge of the second package and adjacent to the second die, and wherein the second die is conductively coupled to the plurality of second antennas and the second radio transceiver;
• and
• establishing a plurality of connections through the respective first and second radio transceivers and antennas between the first package and the second package.

A computing device comprising:

• a first processor package having a first die, a plurality of first antennas, and a first radio transceiver to communicate with a second die, a plurality of second antennas, and a second radio transceiver of a second processor package, wherein the first radio transceiver is positioned near an outer edge of the first package and adjacent to the first die, and wherein the first die is conductively coupled to the plurality of first antennas and the first radio transceiver;
• the second processor package having the second radio transceiver to communicate with the first radio transceiver of the first processor package, wherein the second radio transceiver is positioned near an outer edge of the second package and adjacent to the second die, and wherein the second die is conductively coupled to the plurality of second antennas and the second radio transceiver;
• a switch to communicate with the first processor package and the second processor package and to establish a plurality of connections through the respective first and second radio transceivers and antennas between the first processor package and the second processor package;
• a system board to carry the first processor package, the second processor package, and the switch;
• and
• a chipset carried by the system board coupled through the system board to the first processor package and the second processor package to connect to external storage devices.