Dual bond pad structure for photonics
AssigneeInternational Business Machines Corporation
InventorsJeffrey P. Gambino, Richard S. Graf, Robert K. Leidy, Jeffrey C. Maling
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Abstract
A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
Claims20
A method, comprising:
- forming a bonding layer on a substrate;
- forming solder bumps on the bonding layer;
- forming a masking layer over the bonding layer;
- patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon;
- attaching a laser diode to selected bonding pads using solder connections formed on the laser diode such that the laser diode is unobstructed by the solder bumps;
- and
- attaching an interposer substrate to the solder bumps formed on the bonding pads such that the interposer substrate is spaced away and disconnected from the laser diode.
A method, comprising:
- forming a bonding layer on a substrate;
- forming a masking layer over portions of the bonding layer;
- patterning the bonding layer to form bonding pads for connecting an interposer substrate and a laser diode;
- forming solder bumps on a set of the bonding pads;
- attaching the laser diode to another set of the bonding pads on a side of the solder bumps by a reflow process of solder connections attached to the laser diode such that the laser diode is spaced away and disconnected from the interposer substrate and is unobstructed by the solder bumps;
- and
- reflowing the solder bumps to connect the interposer substrate to the set of the bonding pads after the attaching of the laser diode.
Dependencies are inferred from the claim text.