Antenna integrated printed wiring board (AiPWB)
AssigneeThe Boeing Company
InventorJulio Angel Navarro
Life of this patent
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Abstract
Disclosed is an improved antenna integrated printed wiring board (“IAiPWB”). The IAiPWB includes a printed wiring board (“PWB”), a first radiating element, and a first split-via. The PWB has a bottom surface and the first radiating element is integrated into the PWB. The first radiating element has a first radiator. The first probe is in signal communication with the first radiator and the first split-via, where a portion of the first split-via is integrated into the PWB at the bottom surface.
Claims22
An antenna integrated printed wiring board comprising:
- a printed wiring board having a bottom surface, wherein the printed wiring board includes a ledge at the bottom surface;
- a first radiating element having a first radiator and a first probe in signal communication with the first radiator, wherein the first radiating element is integrated into the printed wiring board;
- and
- a first split-via in signal communication with the first probe, wherein a first portion of the first split-via is integrated into the printed wiring board at the bottom surface, and wherein a second portion of the first split-via is integrated into the ledge.
A method of fabricating an antenna integrated printed wiring board on a printed wiring board, the method comprising:
- producing a printed wiring board stack along a vertical central axis from a plurality of printed wiring board layers, wherein the printed wiring board stack has a top surface, a bottom surface, a first probe, and a first radiator, wherein the first probe has a top portion and a bottom portion, and wherein the top portion of the first probe is in signal communication with the first radiator;
- removing a first material from the top surface of the printed wiring board stack to produce a first neck for a first radiating element;
- removing a second material from the bottom surface of the printed wiring board stack to produce a first split-via at the bottom surface of the first probe, wherein a portion of the first split-via is integrated into a ledge at the bottom surface of the printed wiring board;
- adding a first conductive layer on the top surface of the printed wiring board stack;
- adding a second conductive layer on the bottom surface of the printed wiring board stack;
- removing a first portion of the first conductive layer from the top surface of the printed wiring board stack at the first radiating element;
- removing a first portion of the second conductive layer from the bottom surface of the printed wiring board stack at a first side of the first split-via;
- and
- removing a second portion of the second conductive layer from the bottom surface of the printed wiring board stack at a second side of the first split-via.
Dependencies are inferred from the claim text.