Method of manufacturing a battery, battery and integrated circuit

A battery, comprising:

• a first semiconductor substrate having a first main surface, the first main surface comprising an active region and a bonding area, a first ditch being formed in the bonding area, the first ditch having a depth of 100 to 300 μm;
• an anode at the first semiconductor substrate in the active region;
• a carrier comprising an insulating material, the carrier having a first main surface;
• a cathode at the carrier;
• the first semiconductor substrate and the carrier being stacked so that the first main surface of the first semiconductor substrate is disposed on a side adjacent to the first main surface of the carrier, a cavity being formed between the first semiconductor substrate and the carrier, an adhesive being arranged between the carrier and the first semiconductor substrate in the bonding area;
• and
• an electrolyte in the cavity,
• wherein the first ditch is configured to receive excessive adhesive so that the adhesive does not reach the cavity, and
• wherein the adhesive in the bonding area is completely covered by the insulating material of the carrier.