Light emitting device package having improved reliability, and lighting apparatus including the package

A light emitting device package, comprising:

• a substrate;
• a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer;
• a first through-hole penetrating the second conductive semiconductor layer and the active layer to expose the first conductive semiconductor layer;
• a first electrode disposed in the first through-hole to be connected to the first conductive semiconductor layer;
• a second electrode connected to the second conductive semiconductor layer;
• a first pad connected to the first electrode;
• an insulation layer disposed under the light emitting structure and comprising:
• a first insulation layer disposed between the first pad and the second conductive semiconductor layer;
• a second insulation layer disposed to extend from the first insulation layer into an inside of the first through-hole;
• and
• a third insulation layer disposed to extend from the first insulation layer to an external side surface of the light emitting structure and to be spaced apart from an edge of the substrate by a first distance;
• and
• a second pad connected to the second electrode through a second through-hole penetrating the first insulation layer, the second pad being configured to be electrically spaced apart from the first pad,
• wherein the second pad comprises a recessed portion formed at one side of the second pad in a direction in which the recessed portion is spaced apart from the first pad,
• wherein the first electrode comprises:
• a first portion contacting the first conductive semiconductor layer;
• and
• a second portion extending from the first portion toward the second pad and disposed in the recessed portion, while not overlapping the second pad in a thickness direction of the light emitting structure, and
• wherein the second pad is spaced apart from the second portion of the first electrode by a gap in a plane, the gap being within a range of 5 μm to 20 μm.