Light-emitting diode package and method of manufacturing the same

A method of manufacturing a light-emitting diode (LED) package, the method comprising:

• preparing a mold defined to include a plurality of shapes of a reflective structure, wherein the reflective structure comprises a cavity, a bottom portion having a through hole, and a sidewall portion surrounding the cavity and the bottom portion, the sidewall portion having an inclined inner side surface;
• forming a reflective structure panel comprising a plurality of reflective structures by using the mold;
• forming an electrode pad in a through hole formed in a bottom portion of each of the plurality of reflective structures;
• arranging an LED on the bottom portion of each of the plurality of reflective structures, the LED being electrically connected to the electrode pad;
• and
• forming a lens structure filling the cavity, the lens structure comprising a microlens formed hemispherically on an upper flat portion of each of the plurality of reflective structures.

A method of manufacturing a light-emitting diode (LED) package, the method comprising:

• preparing a mold defined to include a plurality of shapes of a reflective structure, wherein the reflective structure comprises a cavity, a bottom portion having a first through hole and a second through hole spaced apart from each other, and a sidewall portion surrounding the cavity and the bottom portion, the sidewall portion having an inclined inner side surface;
• forming a reflective structure panel comprising a plurality of reflective structures by using the mold;
• forming a first electrode pad in the first through hole and a second electrode pad in the second through hole, in a bottom portion of each of the plurality of reflective structures;
• arranging an LED on the bottom portion of each of the plurality of reflective structures, the LED comprising a light-emitting structure, a phosphor formed on the light-emitting structure, and a support substrate formed on the phosphor and having a top surface substantially identical to a top surface of each of the plurality of reflective structures, wherein, in the light-emitting structure, a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer are sequentially stacked, the first conductive semiconductor layer is connected to the first electrode pad, and the second conductive semiconductor layer is connected to the second electrode pad;
• and
• forming a lens structure filling the cavity, the lens structure comprising a microlens on each of the plurality of reflective structures.