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US 10,475,968 B1Granted
Optoelectronic component and a method for producing an optoelectronic component
AssigneeOSRAM Opto Semiconductors GmbH
InventorsYi Zheng, Victor Perez
Life of this patent
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Abstract
In one embodiment, an optoelectronic component includes a semiconductor chip, which is able to emit radiation. A conversion element comprises at least one wavelength converting phosphor dispersed in a matrix material. The matrix material is a low-melting phosphate glass and water resistant. The optoelectronic component emits in operation warm white light.
Claims20
An optoelectronic component comprising:
- a semiconductor chip;
- a conversion element, which comprises a wavelength converting phosphor dispersed in a matrix material;
- wherein the matrix material is a low-melting phosphate glass and water resistant;
- wherein the low-melting phosphate glass comprises P2O5, Al2O3, B2O3, Na2O, K2O and F;
- and
- wherein the optoelectronic component is configured to emit warm white light during operation, the light being emitted from the semiconductor chip and through the conversion element.
3 more elements
A method for producing an optoelectronic component, the method comprising:
- forming a conversion element over a main surface of a semiconductor chip;
- wherein the conversion element comprises a wavelength converting phosphor dispersed in a matrix material;
- wherein the matrix material is a low-melting phosphate glass and water resistant;
- wherein the low-melting phosphate glass comprises P2O5, Al2O3, B2O3, Na2O, K2O and F;
- and
- wherein the optoelectronic component is configured to emit warm white light during operation, the light being emitted from the semiconductor chip and through the conversion element.
3 more elements
A method comprising:
- providing a powdered matrix material, which is a low-melting phosphate glass and is water resistant;
- providing a powdered phosphor that able to convert radiation;
- mixing the powdered matrix material and the powdered phosphor;
- and
- sintering the mixture of the powdered matrix material and the powdered phosphor at a maximum processing temperature of 400° C. under reducing atmosphere.
2 more elements
Dependencies are inferred from the claim text.