Optical coupling device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorHidetoshi Kuraya
Life of this patent
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Abstract
An optical coupling device includes a first lead frame, a second lead frame, a first mounting member, a second mounting member, the members respectively provided on the first lead frame and, the second lead frame a light emitter provided on the first mounting member, a light receiver provided on the second mounting member, a first wire and a second wire electrically connecting the light emitter to the first lead frame, and the light receiver to the second lead frame, and an outer resin enclosure enclosing a part of the first lead frame and the second lead frame, the light emitter, and the light receiver, wherein at least the light emitter and the light receiver in the outer resin enclosure are covered with a silicone resin cured material.
Claims13
An optical coupling device comprising:
- an enclosure;
- a first lead frame and a second lead frame;
- a first mounting member and a second mounting member provided on the first lead frame and the second lead frame, respectively;
- a light emitter provided on the first mounting member within the enclosure;
- a light receiver provided on the second mounting member inside the enclosure;
- a first wire and a second wire electrically connecting the light emitter to the first lead frame, and the light receiver to the second lead frame, respectively;
- and
- a silicone resin cured material disposed inside the enclosure;
- wherein,
- an expansion rate of 25° C. to 265° C. in the silicone resin cured material is in a range of 0.39% to 0.65%,
- the first lead frame comprises a first outer lead and a first planar portion on which the first mounting member is provided,
- the second lead frame is arranged opposed to the first lead frame and comprises a second outer lead and a second planar portion on which the second mounting member is provided, and
- a region inside the enclosure between the first lead frame and the second lead frame is filled with the silicone resin cured material and without an epoxy resin material.
Dependencies are inferred from the claim text.