Fan-out sensor package and camera module

A fan-out sensor package comprising:

• a core member having a through-hole;
• an integrated circuit (IC) for a sensor disposed in the through-hole, the IC having
• a first surface having a sensor region and first connection pads disposed thereon,
• a second surface opposing the first surface and having second connection pads disposed thereon, and
• through-silicon vias (TSVs) penetrating between the first and second surfaces and electrically connecting the first and second connection pads to each other;
• an encapsulant covering the core member and the second surface of the IC and filling at least portions of the through-hole;
• a redistribution layer disposed on a lower surface of the encapsulant;
• and
• vias penetrating through at least portions of the encapsulant covering the second surface of the IC and electrically connecting the redistribution layer and the second connection pads to each other,
• wherein the first surface of the IC is substantially coplanar with an upper surface of the encapsulant and an upper surface of the core member.