Semiconductor apparatus installing passive device
AssigneeSumitomo Electric Device Innovations, Inc.
InventorAkitada Kodama
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Abstract
A semiconductor apparatus that comprises a package, an active device, and a passive device is disclosed. The package includes a metal base, a shell, and a lid. The active device is mounted of the metal base. The passive device is soldered on the metal base. The passive device includes an insulating substrate with a rectangular outer shape and a bottom electrode with a plane shape reflecting the rectangular outer shape of the insulating substrate. The insulating substrate is made of material with brittleness greater than that of the metal base. A feature of the invention is that the bottom electrode has cut corners.
Claims17
A semiconductor apparatus, comprising:
- a package including a metal base, a shell primarily made of metal, and a lid;
- an active device mounted on the metal base;
- and
- a passive device soldered on the metal base, the passive device including an insulating substrate with a rectangular outer shape and a bottom electrode soldered to the metal base, the insulating substrate being made of material having brittleness greater than the metal base,
- wherein the bottom electrode of the passive device has a plane shape reflecting the rectangular outer shape of the insulating substrate but corners thereof are cut.
The semiconductor apparatus of clam 13,
- wherein the top electrode and the bottom electrode are made of primarily gold (Au), and
- wherein the top electrode has a thickness greater than a thickness of the bottom electrode.
Dependencies are inferred from the claim text.