Fan-out semiconductor package module

A fan-out semiconductor package module comprising:

• a core member having a first through-hole and a second through-hole spaced apart from each other;
• a semiconductor chip disposed in the first through-hole, and having an active surface with a connection pad and an inactive surface opposing the active surface;
• a first passive component disposed in the second through-hole;
• a first encapsulant covering at least portions of the core member and the first passive component, and filling at least a portion of the second through-hole;
• a reinforcing member disposed on the first encapsulant;
• a second encapsulant covering at least a portion of the semiconductor chip, and filling at least a portion of the first through-hole;
• and
• a connection member disposed on the core member, the active surface of the semiconductor chip, and the first passive component, the connection member including a redistribution layer electrically connected to the connection pad, and the first passive component,
• wherein the reinforcing member has an elastic modulus greater than that of the first encapsulant.

A fan-out semiconductor package module comprising:

• a core member having a first through-hole and a second through-hole;
• a reinforcing layer over the core member, having a first through-hole over the first through-hole of the core member, and covering the second through-hole;
• a first component in the first through-hole;
• a second component in the second through-hole;
• and
• an encapsulant at least covering portions of the reinforcing layer and the first component.