Semiconductor package device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHsu-Nan Fang, Chun-Jun Zhuang
Life of this patent
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Abstract
A semiconductor package device comprises a circuit layer, an electronic component disposed on the circuit layer, a package element and a first encapsulant. The package element is disposed on the circuit layer. The package element includes at least two electrical contacts electrically connected to the circuit layer. The first encapsulant is disposed on the circuit layer. The first encapsulant encapsulates the electronic component and the package element and exposes the electrical contacts of the package element.
Claims18
A semiconductor package device, comprising:
- a circuit layer;
- an electronic component disposed on the circuit layer;
- a package element disposed on the circuit layer, the package element including at least two electrical contacts electrically connected to the circuit layer;
- and
- a first encapsulant disposed on the circuit layer, the first encapsulant encapsulating the electronic component and the package element and exposing the electrical contacts of the package element,
- wherein the package element includes a component and a second encapsulant,
- the component includes a passive component, and the electrical contacts are exposed from the second encapsulant,
- the second encapsulant includes a plurality of fillers,
- at least one of the fillers adjacent to a boundary between the first encapsulant and the second encapsulant has a planar surface, and
- the boundary is substantially perpendicular to a first surface of the circuit layer.
A semiconductor package device, comprising:
- a circuit layer;
- a first electronic component disposed on the circuit layer;
- a package element disposed on the circuit layer, the package element including a second electronic component and a first encapsulant encapsulating the second electronic component;
- and
- a second encapsulant disposed on the circuit layer and encapsulating the first electronic component and the package element,
- wherein the first encapsulant comprises a plurality of fillers, the second encapsulant comprises a plurality of fillers, at least one of the fillers of the first encapsulant is adjacent to a boundary between the first encapsulant and the second encapsulant and has a planar surface, the boundary is substantially perpendicular to a first surface of the circuit layer, and the fillers of the first encapsulant and the fillers of the second encapsulant are discontinuous at the boundary between the first encapsulant and the second encapsulant.
Dependencies are inferred from the claim text.