Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods
AssigneeMicron Technology, Inc.
InventorsWei Zhou, Bret K. Street
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a first die; a first metal enclosure directly contacting and vertically extending below the first die, wherein the first metal enclosure peripherally encircles a first enclosed space; a second die directly contacting the first metal enclosure opposite the first die; a second metal enclosure directly contacting and vertically extending below the second die, wherein the second metal enclosure peripherally encircles a second enclosed space; and an enclosure connection mechanism directly contacting the first metal enclosure and the second metal enclosure for electrically coupling the first metal enclosure and the second metal enclosure.
Claims15
A semiconductor device, comprising:
- a first die;
- a first metal enclosure directly contacting and vertically extending below the first die, wherein the first metal enclosure peripherally encircles a first enclosed space;
- a second die directly contacting the first metal enclosure opposite the first die;
- a second metal enclosure directly contacting and vertically extending below the second die, wherein the second metal enclosure peripherally encircles a second enclosed space;
- and
- an enclosure connection mechanism directly contacting the first metal enclosure and the second metal enclosure for electrically coupling the first metal enclosure and the second metal enclosure, wherein the enclosure connection mechanism includes one or more through-silicon vias (TSVs) extending vertically through the second die.
A semiconductor device including a die stack having at least two dies, comprising:
- a plurality of interconnects electrically coupling three or more adjacent dies of the die stack;
- a first metal sealing member disposed between a pair of adjacent dies, wherein the first metal sealing member encloses a first set of a plurality of interconnects;
- a second metal sealing member below the pair of adjacent dies, wherein the second metal sealing member encloses a second set of a plurality of interconnects;
- and
- an enclosure connection mechanism directly contacting the first metal enclosure and the second metal enclosure for electrically coupling the first metal enclosure and the second metal enclosure that are vertically separated with one or more dies there between.
Dependencies are inferred from the claim text.