Redistribution layers in semiconductor packages and methods of forming same

A package comprising:

• a first die comprising a first conductive via;
• an encapsulant disposed around the first die;
• a second conductive via extending through the encapsulant;
• and
• a conductive line over the first die and the encapsulant, wherein the conductive line electrically connects the first conductive via to the second conductive via, wherein in a top-down view, a direction along which the conductive line extends changes at a first point disposed over the first die and further changes at a second point disposed over the encapsulant.

A package comprising:

• a first die comprising a first conductive via;
• a second die comprising a second conductive via;
• an encapsulant around the first die and the second die, wherein a portion of the encapsulant is disposed between the first die and the second die;
• a conductive line electrically connecting the first conductive via and the second conductive via, wherein the conductive line comprises:
• a first segment over the first die and disposed at a first angle relative a line extending through respective centers of the first conductive via and the second conductive via;
• a second segment extending across a boundary between the first die and the encapsulant, wherein the second segment is disposed at a second angle relative the line;
• and
• a third segment over the second die and disposed at a third angle relative the line, and wherein second angle is different than the first angle and the third angle.