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US 10,475,765 B2Granted
Interposer substrate and method for manufacturing the same
AssigneePhoenix Pioneer Technology Co., Ltd.
InventorsShih-Ping Hsu, Che-Wei Hsu, Ching-Chieh Chang, Chao-Chung Tseng
Life of this patent
Estimating the term…
Abstract
The disclosure provides an interposer substrate and a method for manufacturing the same. The method includes forming an insulating protection layer having a phosphorus compound on a substrate body, thereby providing toughness and strength as required when the thickness of the interposer substrate becomes too thin, and preventing substrate warpage when the substrate has a shrinkage stress or structural asymmetries.
Claims8
An interposer substrate, comprising:
- a substrate body having a first surface and a second surface opposite to the first surface and including at least one insulating layer and a wiring portion combined with the insulating layer, the wiring portion including a wiring layer formed on the insulating layer and a plurality of conductive posts disposed in the insulating layer and electrically connected to the wiring layer;
- and
- an insulating protection layer formed on the second surface and free from being formed on the first surface of the substrate body and including a phosphorous compound, wherein the insulating protection layer has a coefficient of thermal expansion (CTE) greater than the insulating layer.
A method for manufacturing an interposer substrate, comprising:
- providing a substrate body having a first surface and a second surface opposite to the first surface and including at least one insulating layer and a wiring portion combined with the insulating layer, the wiring portion including a wiring layer formed on the insulating layer and a plurality of conductive posts disposed in the insulating layer and electrically connected to the wiring layer;
- and
- forming on the second surface and free from forming on the first surface of the substrate body an insulating protection layer including a phosphorous compound, wherein the insulating protection layer has a coefficient of thermal expansion (CTE) greater than the insulating layer.
Dependencies are inferred from the claim text.