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US 10,475,764 B2Granted
Die bonder and methods of using the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Shing-Chao Chen, Chung-Shi Liu, Ming-Da Cheng
Life of this patent
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Abstract
A method includes bringing into contact respective first sides of a plurality of dies and a die attach film on a major surface of a carrier wafer, and simultaneously heating portions of the die attach film contacting the plurality of dies in order to simultaneously bond the plurality of dies to the die attach film.
Claims20
A method comprising:
- bringing into contact respective first sides of a plurality of dies with a die attach film, wherein the die attach film is on a major surface of a carrier wafer;
- heating portions of the die attach film in contact with the plurality of dies to cause the plurality of dies to stick to the die attach film, wherein the plurality of dies starts to be heated at a same time;
- after the plurality of dies is bonded to the carrier wafer, molding the plurality of dies with a molding material;
- forming redistribution lines to electrically couple to the plurality of dies;
- and
- releasing the plurality of dies, the molding material, and the redistribution lines from the die attach film.
3 more elements
A method comprising:
- placing a plurality of dies to have first surfaces of the plurality of dies coplanar with each other, wherein the plurality of dies is placed sequentially;
- after the plurality of dies is placed, heating the plurality of dies or a die attach film using a hot plate, with the hot plate being pressed against the plurality of dies, so that second sides of the plurality of dies are adhered to the die attach film through a gluing force;
- and
- after the second sides of the plurality of dies are bonded to the die attach film, moving the hot plate away from the plurality of dies and the die attach film.
1 more element
A method comprising:
- placing a plurality of dies onto a die attach film;
- contacting a hot plate with top surfaces of the plurality of dies;
- heating the plurality of dies using the hot plate, wherein heat is conducted from the hot plate to the die attach film, so that the plurality of dies is bonded to the die attach film;
- with the plurality of dies being bonded to the die attach film, encapsulating the plurality of dies in an encapsulating material, wherein the encapsulating material is in contact with top surfaces of portions of the die attach film;
- forming redistribution lines over the encapsulating material and the plurality of dies, wherein the redistribution lines are electrically connected to the plurality of dies;
- and
- performing a die-saw on the die attach film and the encapsulating material to form a plurality of packages, wherein each of the packages comprises one of the plurality of dies.
4 more elements
Dependencies are inferred from the claim text.