Die bonding apparatus comprising an inert gas environment

A die bonding apparatus comprising:

• a first inert gas container in the form of a first chamber having a first inert gas concentration;
• a second inert gas container in the form of a second chamber having a second inert gas concentration enclosed within the first inert gas container, the second inert gas concentration being higher than the first inert gas concentration;
• a bond head located in the second inert gas container for receiving a die for bonding;
• and
• a third inert gas container located outside the first and second chambers, and movable relative to the first inert gas container and the second inert gas container, the third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding;
• wherein the bond head is operative to move the die between a first position within the second inert gas container and a second position outside the first and second chambers to bond the die onto the substrate located in the third inert gas container.