Composite antenna substrate and semiconductor package module

A composite antenna substrate and semiconductor package module comprising:

• an antenna substrate including:
• a first pattern layer including a first ground pattern and a first antenna pattern,
• a second pattern layer disposed on a level lower than a level of the first pattern layer and including a second ground pattern and a second antenna pattern, and
• a third pattern layer formed of one or more layers, disposed on a level lower than a level of the second pattern layer and including a wiring layer and a feeding pattern, wherein the feeding pattern is electrically connected to the second antenna pattern;
• and
• a fan-out semiconductor package including:
• a semiconductor chip having a first surface having connection pads disposed thereon and a second surface opposing the first surface, an encapsulant encapsulating at least portions of the semiconductor chip, and
• a connection member disposed on the first surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads,
• wherein the antenna substrate is stacked on the fan-out semiconductor package to be connected to the fan-out semiconductor package through a first electrical connection structure.