Fan-out semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeong Hee Choi, Han Kim, Hyung Joon Kim, Mi Ja Han
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Abstract
A fan-out semiconductor package includes: a core member having at least one through-hole formed therein and having a metal layer disposed on an internal surface thereof; an electronic component disposed in the through-hole; an encapsulant encapsulating the core member and the electronic component; a metal plate disposed on an upper surface of the encapsulant; and a wall penetrating the encapsulant to connect the metal layer and the metal plate to each other. The wall includes sections spaced apart from each other.
Claims13
A fan-out semiconductor package comprising:
- a core member having at least one through-hole formed therein and having a metal layer disposed on at least a portion of an upper surface thereof;
- an electronic component disposed in the through-hole;
- an encapsulant encapsulating the core member and the electronic component;
- a metal plate disposed on an upper surface of the encapsulant;
- and
- a wall penetrating the encapsulant to connect the metal layer and the metal plate to each other,
- wherein the wall including sections spaced apart from each other.
A fan-out semiconductor package comprising:
- a core member having at least one through-hole formed therein and having a metal layer disposed on at least a portion of an upper surface thereof;
- an electronic component disposed in the through-hole;
- an encapsulant encapsulating the core member and the electronic component;
- a metal plate disposed on an upper surface of the encapsulant;
- a first wall extending from the metal layer disposed on the upper surface of the core member;
- and
- a second wall extending from a lower surface of the metal plate,
- wherein the first wall and the second wall are offset from each other.
Dependencies are inferred from the claim text.