Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration

A semiconductor package to implement an organic stiffener with an electromagnetic shield, the semiconductor package comprising:

• a substrate layer having electrical traces and a ground plane therein;
• a CPU die electrically interfaced to the electrical traces of the substrate layer;
• a heatpipe thermally interfaced to a top surface of the CPU die;
• wherein sides of the substrate layer are built up to a height coplanar with a top surface of the CPU die forming a cavity within the substrate within which the CPU die is positioned;
• a plurality of copper pillars embodied within the sides of the substrate layer between the ground plane of the substrate layer and the heatpipe, each of the plurality of copper pillars being electrically interfaced to both the heatpipe and the ground plane of the substrate;
• wherein the plurality of copper pillars form the electromagnetic shield to electrically shield the CPU die;
• and
• wherein the sides of the substrate layer built up to a height coplanar with the top surface of the CPU die and having the plurality of copper pillars embodied therein form the organic stiffener are to mechanically retain the substrate layer in a planer form.

A method for implementing an organic stiffener with an electromagnetic shield, the method comprising:

• fabricating a substrate layer having electrical traces and a ground plane therein;
• fabricating a functional semiconductor die;
• electrically interfacing the functional semiconductor die to the electrical traces of the substrate layer;
• thermally interfacing a top surface of the functional semiconductor die to a heatpipe positioned above the functional semiconductor die;
• electrically connecting one or more interposers of an organic dielectric material to the ground plane of the substrate layer;
• electrically connecting the one or more interposers to the heat pipe;
• wherein the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die;
• and wherein the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form, and wherein the method further comprises:
• electrically interfacing a Radio Frequency (RF) semiconductor die to the electrical traces of the substrate layer;
• wherein the RF semiconductor die includes a wireless transceiver to transmit and receive signals wirelessly;
• and wherein the RF semiconductor die is shielded from electromagnetic (EMI) radiation emanating from the functional semiconductor die by the electromagnetic shield which fully encompasses the functional semiconductor die within an EMI cage.

A system to implement an organic stiffener with an electromagnetic shield, the system comprising:

• a processor and a memory to execute instructions;
• a printed circuit board (PCB) motherboard having the processor and the memory mounted thereupon;
• and a semiconductor package mounted to the PCB motherboard, the semiconductor package comprising:
• (i) a substrate layer having electrical traces and a ground plane therein,
• (ii) a functional semiconductor die electrically interfaced to the electrical traces of the substrate layer,
• (iii) a heatpipe thermally interfaced to a top surface of the functional semiconductor die,
• (iv) one or more interposers of an organic dielectric material electrically connected to the ground plane of the substrate layer and electrically connected to the heatpipe, wherein the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die and further wherein the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form;
• and
• (v) a Radio Frequency (RF) semiconductor die electrically interfaced to the electrical traces of the substrate layer and thermally interfaced to the heatpipe;
• wherein the RF semiconductor die includes a wireless transceiver to transmit and receive signals wirelessly;
• and
• wherein the RF semiconductor die is shielded from electromagnetic (EMI) radiation emanating from the functional semiconductor die by the electromagnetic shield which fully encompasses the functional semiconductor die within an EMI cage.

An apparatus to implement an organic stiffener with an electromagnetic shield, the apparatus comprising:

• a substrate layer having electrical traces and a ground plane therein;
• a functional semiconductor die electrically interfaced to the electrical traces of the substrate layer;
• a heatpipe thermally interfaced to a top surface of the functional semiconductor die;
• one or more interposers of an organic dielectric material electrically connected to the ground plane of the substrate layer and electrically connected to the heatpipe, wherein the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die, wherein the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form;
• and
• a Radio Frequency (RF) semiconductor die electrically interfaced to the electrical traces of the substrate layer and thermally interfaced to the heatpipe;
• the RF semiconductor die having a wireless transceiver to transmit and receive signals wirelessly, wherein the RF semiconductor die is shielded from electromagnetic (EMI) radiation emanating from the functional semiconductor die by the electromagnetic shield which fully encompasses the functional semiconductor die within an EMI cage.

An apparatus to implement an organic stiffener with an electromagnetic shield, the apparatus comprising:

• a substrate layer having electrical traces and a ground plane therein;
• a functional semiconductor die electrically interfaced to the electrical traces of the substrate layer;
• a heatpipe thermally interfaced to a top surface of the functional semiconductor die;
• one or more interposers of an organic dielectric material electrically connected to the ground plane of the substrate layer and electrically connected to the heatpipe;
• wherein the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die;
• and
• wherein the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form, wherein the one or more interposers each embody a plurality of copper pillars being electrically interfaced between the heatpipe and the substrate, the plurality of copper pillars of the one or more interposers forming the electromagnetic shield to electrically shield the functional semiconductor die, and wherein a separation distance between each of the plurality of copper pillars of the one or more interposers is frequency calibrated to a maximum frequency of operation and harmonic frequencies which emanate from the functional semiconductor die during operation;
• and
• wherein the maximum frequency of operation and the harmonic frequencies are modeled prior to design of the separation distance between each of the plurality of copper pillars.

An apparatus to implement an organic stiffener with an electromagnetic shield, the apparatus comprising:

• a substrate layer having electrical traces and a ground plane therein;
• a functional semiconductor die electrically interfaced to the electrical traces of the substrate layer;
• a heatpipe thermally interfaced to a top surface of the functional semiconductor die;
• one or more interposers of an organic dielectric material electrically connected to the ground plane of the substrate layer and electrically connected to the heatpipe, wherein the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die, and wherein the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form;
• and
• one or more inductors embodied within the one or more interposers, the one or more inductors to provide power delivery to the functional semiconductor die.