Integrated fan-out package and method for fabricating the same

A method for fabricating integrated fan-out packages, comprising:

• providing a first redistribution circuit structure having a first surface and a second surface opposite to the first surface on a carrier;
• mounting a plurality of semiconductor devices onto the second surface of the first redistribution circuit structure after the first redistribution circuit structure is provided;
• forming an insulating encapsulation over the second surface of the first redistribution circuit structure to encapsulate the semiconductor devices after the plurality of semiconductor devices are mounted onto the first redistribution circuit structure, wherein the insulating encapsulation has a first insulating portion and a second insulating portion, and the second insulating portion encapsulates the semiconductor devices;
• removing the carrier;
• after the carrier is removed, providing an integrated circuit over the first surface of the first redistribution circuit structure by disposing a die-attach film between a rear surface of the integrated circuit and the first surface of the first redistribution circuit structure, wherein the integrated circuit has an active surface opposite to the rear surface, and the integrated circuit is electrically connected to the first redistribution circuit structure;
• forming a passivation layer on the active surface of the integrated circuit, wherein the passivation layer exposes a plurality of conductive pads of the integrated circuit;
• and
• forming the first insulating portion of the insulating encapsulation over the first surface of the first redistribution circuit structure to encapsulate the integrated circuit.

A method for fabricating integrated fan-out packages, comprising:

• forming a first redistribution circuit structure on a carrier;
• mounting an integrated circuit onto the first redistribution circuit structure;
• forming a first insulating portion of an insulating encapsulation over the carrier to encapsulate the integrated circuit;
• forming a second redistribution circuit structure over the integrated circuit and the first insulation portion, wherein the second redistribution circuit structure has a first surface and a second surface opposite to the first surface, and the integrated circuit is disposed between the first surface and the carrier;
• adhering a substrate to the second surface of the second redistribution circuit structure after the second redistribution circuit structure is formed;
• removing the carrier to reveal a surface of the first redistribution circuit structure;
• after the carrier is removed, mounting a plurality of semiconductor devices on the surface of the first redistribution circuit structure;
• and
• forming a second insulating portion of the insulating encapsulation over the surface of the first redistribution circuit structure to encapsulate the semiconductor devices.