Via architecture for increased density interface

A computing device comprising:

• a processor mounted on a substrate;
• wherein the substrate comprises:
• a first metal layer and a second metal layer;
• a ground plane in the first metal layer;
• a first signal trace in the second metal layer, the first signal trace electrically coupled to a first signal pad in the first metal layer by a first signal via;
• a second signal trace in the second metal layer, the second signal trace electrically coupled to a second signal pad in the first metal layer by a second signal via;
• and
• a first ground trace in the second metal layer between the first signal trace and the second signal trace, the first ground trace electrically coupled to the ground plane by a first ground via;
• a second ground trace in the second metal layer, the first signal trace between the first ground trace and the second ground trace, the second ground trace electrically coupled to the ground plane by a second ground via;
• and
• a third ground trace in the second metal layer, the second signal trace between the first ground trace and the third ground trace, the third ground trace electrically coupled to the ground plane by a third ground via.

A package substrate comprising:

• a first metal layer and a second metal layer;
• a ground plane in the first metal layer;
• a first signal trace in the second metal layer, the first signal trace electrically coupled to
• a first signal pad in the first metal layer by a first signal via, and the first signal via having a width substantially equal to a width of the first signal trace;
• a second signal trace in the second metal layer, the second signal trace electrically coupled to a second signal pad in the first metal layer by a second signal via, and the second signal via has a width substantially equal to a width of the second signal trace;
• and
• a ground trace in the second metal layer between the first signal trace and the second signal trace, the ground trace electrically coupled to the ground plane by a ground via.