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US 10,475,730 B2Granted
Preformed lead frame device and lead frame package including the same
AssigneeChang Wah Technology Co., Ltd.
InventorChia-Neng Huang
Life of this patent
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Abstract
A preformed lead frame device includes a molding layer and a plurality of spaced-apart lead frame units. The molding layer is made of a polymer material, and includes a plurality of framed portions, and a plurality of longitudinal and transverse frame sections intersecting each other to frame the framed portions. The lead frame units are arranged in an array and made of metal. Each of the lead frame units is embedded in a respective one of the framed portions and includes a plurality of spaced-apart leads.
Claims9
A preformed lead frame device, comprising:
- a molding layer made of a polymer material and including a plurality of framed portions, and a plurality of longitudinal and transverse frame sections intersecting each other to frame said framed portions;
- and
- a plurality of spaced-apart lead frame units arranged in an array and made of metal, each of said lead frame units being embedded in a respective one of said framed portions and including a plurality of spaced-apart leads,
- wherein each of said leads of each of said lead frame units has a top surface that is flush with a topmost surface of said molding layer, and a bottom surface that is flush with a bottommost surface of said molding layer;
- wherein each of said longitudinal and transverse frame sections of said molding layer has a first height (h1) from said bottommost surface of said molding layer;
- and
- wherein each of said leads of each of said lead frame units has a second height (h2) from said bottommost surface of said molding layer, the first height (h1) being smaller than the second height (h2) such that said longitudinal and transverse frame sections are indented from said topmost surface of said molding layer and serve as dicing paths.
4 more elements
Dependencies are inferred from the claim text.