Apparatus for bonding flexible part including inclined leads
AssigneeProtec Co., Ltd.
InventorsMoo Sup Shim, Seong Yong Ji, Hyoung Yeon Ju, Chiho Cho
Life of this patent
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Abstract
An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.
Claims8
An apparatus for bonding a flexible part including inclined leads, wherein the apparatus bonds at least one inclined lead of a first part inclined with respect to a plane where the first part and a second part face each other, to at least one inclined pad of the second part formed to face the at least one inclined lead, the apparatus comprising:
- a base;
- a support bracket rotatably mounted with respect to the base;
- a first fixing member clamping the first part;
- a second fixing member clamping the second part;
- a first transporting unit transporting the first fixing member relative to the support bracket in a direction in which the first fixing member moves near the second part clamped by the second fixing member;
- a second transporting unit transporting the second fixing member relative to the support bracket such that a location of the second part is aligned with respect to the first part clamped by the first fixing member;
- a bonding head bonding the at least one inclined lead of the first part to the at least one inclined pad of the second part;
- and
- a tilt unit rotating the support bracket with respect to the base such that the at least one inclined lead of the first part and the at least one inclined pad of the second part face the bonding head.
Dependencies are inferred from the claim text.