Semiconductor device, manufacturing method for semiconductor device, and electrode plate

A semiconductor device comprising:

• an electrode plate, on a surface of which, a first groove having a rectangular ring shape and a plurality of sets of second grooves are provided,
• the first groove having a first linear part, a second linear part, a third linear part, and a fourth linear part extending along respective four sides of the rectangular ring shape,
• the plurality of sets of second grooves being arranged within a range surrounded by the fours sides of the first groove and having end portions on an outer periphery side that are connected with the first groove,
• each of the plurality of sets of second grooves including a plurality of second grooves, and
• the plurality of sets of second grooves including:
• a first set of second grooves having a plurality of second grooves connected with the first linear part of the first groove,
• a second set of second grooves having a plurality of second grooves connected with the second linear part of the first grooves,
• a third set of second grooves having a plurality of second grooves connected with the third linear part of the first groove, and
• a fourth set of second grooves having a plurality of second grooves connected with the fourth linear part of the first groove;
• a metallic member;
• and
• solder that connects a surface of the electrode plate within the range and a surface of the metallic member, the surface of the metallic member facing the surface of the electrode plate, wherein,
• when the metallic member is seen in a lamination direction of the electrode plate and the metallic member, an outer peripheral edge of a region of the metallic member, the region being connected with the solder, is arranged so as to go across the first set of second groove, the second set of second groove, the third set of second groove, and the fourth set of second groove and, set of second groove, the third set of second groove, and the fourth set of second groove, and, and
• wherein the second grooves of the first set are not connected with the second grooves of the second to fourth sets, and the solder is covered by resin.

An electrode plate for connecting a semiconductor chip comprising:

• an electrode plate, on a surface of which, a first groove and a plurality of sets of second grooves are provided,
• the first groove having a first linear part, a second linear part, a third linear part, and a fourth linear part extending along respective four sides of a rectangular ring shape,
• the plurality of sets of second grooves being arranged within a range surrounded by the respective four sides of the first groove and having end portions on an outer periphery side that are connected with the first groove,
• each of the plurality of sets of second grooves including a plurality of second grooves,
• the plurality of sets of second grooves including:
• a first set of second grooves having a plurality of second grooves connected with the first linear part of the first groove,
• a second set of second grooves having a plurality of second grooves connected with the second linear part of the first groove,
• a third set of second grooves having a plurality of second grooves connected with the third linear part of the first groove, and
• a fourth set of second grooves having the plurality of second grooves connected with the fourth linear part of the first groove, and
• the range being for joining a solder,
• wherein the electrode plate includes a flat surface in a center of the range, the flat surface not having the plurality of sets of second grooves.