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US 10,475,717 B2Granted
Semiconductor chip, method for mounting semiconductor chip, and module in which semiconductor chip is packaged
AssigneeMurata Manufacturing Co., Ltd.
InventorsIsao Obu, Yasunari Umemoto, Masahiro Shibata
Life of this patent
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Abstract
A semiconductor chip includes a single-crystal substrate and a metal electrode on the bottom surface of the substrate. The metal electrode has a region in which a first metal is exposed and a region in which a second metal is exposed, the second metal having a standard electrode potential different from that of the first metal.
Claims9
A semiconductor chip comprising:
- a single-crystal substrate;
- a metal electrode on a bottom surface of the substrate, the metal electrode having a region in which a first metal is exposed and a region in which a second metal is exposed, the second metal having a standard electrode potential different from a standard electrode potential of the first metal;
- and
- a via hole extending from the bottom surface of the substrate to a top surface of the substrate,
- wherein the first metal covers an entire portion of the bottom surface of the substrate and the via hole, and the second metal covers a part of a surface of the first metal covering the bottom surface of the substrate other than the via hole.
2 more elements
Dependencies are inferred from the claim text.