Two material high K thermal encapsulant system

A method comprising:

• placing a first encapsulant that is made of a first material onto a first die such that the first material occupies a plurality of separate and non-contiguous volumes between the first die and the second die;
• placing a second encapsulant that is made of a second material onto the first die such that the third material occupies a separate and non-contiguous volume between the first die and the second die;
• placing a third encapsulant that is made of a third material onto the first die such that the third encapsulant surrounds each of the plurality of separate and non-contiguous volumes of the first encapsulant between the first die and the second die and surrounds separate and non-contiguous volume of the third encapsulant between the first die and the second die, wherein the first material has a higher thermal conductivity than the third material and the third material provides greater adhesion between the first and second dies than the first material, wherein the third material has a different thermal conductivity than the first encapsulant and the second encapsulant;
• and
• stacking a second die onto the first die such the first encapsulant and the second encapsulant are between the first die and the second die.