US 10,475,688 B2Granted

Electrostatic chuck device, and semiconductor manufacturing device

AssigneeSumitomo Osaka Cement Co., Ltd.

InventorsKazunori Ishimura, Kazuto Ando, Kentaro Takahashi, Yuhki Kinpara, Shinichi Maeta, Mamoru Kosakai

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Abstract

An electrostatic chuck part of an electrostatic chuck device has an electrostatic chuck part inner peripheral surface surrounding an opening of a chuck part through-hole, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface. An insulator has an insulator main body in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, an insulator inner end face, and an insulator outer end face which faces the electrostatic chuck part outer peripheral surface. The insulator inner end face and the electrostatic chuck part inner peripheral surface are in contact with each other, or an adhesion layer or a plasma-resistant adhesive layer extends in a gap between the insulator inner end face and the electrostatic chuck part inner peripheral surface. The plasma-resistant adhesive layer is formed between the electrostatic chuck part outer peripheral surface and the insulator outer end face.

Claims10

Dependent claims

An electrostatic chuck device comprising:

an electrostatic chuck part having a placing surface on which a plate-shaped sample is plated;
a cooling base part which cools the electrostatic chuck part;
an adhesion layer formed between the electrostatic chuck part and the cooling base part so as to bond the electrostatic chuck part and the cooling base part together;
a through-hole having a chuck part through-hole penetrating the electrostatic chuck part, and a base part through-hole penetrating the cooling base part so as to communicate with the chuck part through-hole and having a larger diameter than the chuck part through-hole;
and
an insulator provided in the base part through-hole,
wherein the electrostatic chuck part has an electrostatic chuck part inner peripheral surface surrounding an opening of the chuck part through-hole on the cooling base part side of the electrostatic chuck part, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface on the cooling base part side of the electrostatic chuck part,
a cooling base recess portion is formed on the electrostatic chuck part side of the base part through-hole of the cooling base part,
the insulator has an inner insulator in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, and an outer insulator surrounding the inner insulator,
in order prevent infiltration of plasma entering through the through-hole, the inner insulator and the electrostatic chuck part inner peripheral surface are in contact with each other, or the adhesion layer extends in a gap between the inner insulator and the electrostatic chuck part inner peripheral surface, and the insulator has an insulator inner end face formed on the electrostatic chuck part side of the insulator, and an insulator outer end face formed on the electrostatic chuck part side of the insulator so as to face the electrostatic chuck part outer peripheral surface, and
the side opposite to the electrostatic chuck part of the outer insulator is located in the cooling base recess portion.

8 more elements

An electrostatic chuck device comprising:

an electrostatic chuck part having a placing surface on which a plate-shaped sample is plated;
a cooling base part which cools the electrostatic chuck part;
an adhesion layer formed between the electrostatic chuck part and the cooling base part so as to bond the electrostatic chuck part and the cooling base part together;
a through-hole having a chuck part through-hole penetrating the electrostatic chuck part, and a base part through-hole penetrating the cooling base part so as to communicate with the chuck part through-hole and having a larger diameter than the chuck part through-hole;
an insulator provided in the base part through-hole;
and
a plasma-resistant adhesive layer disposed between the insulator and the electrostatic chuck part,
wherein the electrostatic chuck part has an electrostatic chuck part inner peripheral surface surrounding an opening of the chuck part through-hole on the cooling base part side of the electrostatic chuck part, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface on the cooling base part side of the electrostatic chuck part,
the insulator has an insulator main body in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, an insulator inner end face formed on the electrostatic chuck part side of the insulator main body, and an insulator outer end face formed on the electrostatic chuck part side of the insulator main body so as to face the electrostatic chuck part outer peripheral surface,
in order to prevent infiltration of plasma entering through the through-hole, the insulator inner end face and the electrostatic chuck part inner peripheral surface are in contact with each other, or the adhesion layer or the plasma-resistant adhesive layer extends in a gap between the insulator inner end face and the electrostatic chuck part inner peripheral surface, and
the plasma-resistant adhesive layer is formed between the electrostatic chuck part outer peripheral surface and the insulator outer end face.

8 more elements

Dependencies are inferred from the claim text.